Micro LED is considered one of the most promising next-generation display technologies. Compared with LCD and OLED displays, Micro LED offers higher brightness, lower power consumption, longer lifetime, and superior reliability.
However, mass transfer and packaging processes remain key challenges for large-scale production.
During Micro LED manufacturing, contaminants on chip surfaces, substrates, and packaging materials can negatively affect transfer accuracy and bonding reliability.
Plasma surface treatment effectively removes organic contaminants and microscopic particles while increasing surface energy and adhesion performance.
Typical applications include:
Mass transfer preparation
Chip bonding
Packaging adhesive treatment
Protective coating processes
Display module assembly
PLAUX Plasma System provides advanced plasma treatment solutions for Micro LED, Mini LED, and semiconductor packaging industries.
