HBM (High Bandwidth Memory) has become a critical component in AI accelerators, GPUs, and high-performance computing systems. As HBM technology evolves toward higher stacking layers and greater integration density, packaging reliability becomes increasingly important.
During HBM packaging processes, wafer surfaces, TSV structures, micro bumps, and interposers may contain organic contaminants, oxide layers, and microscopic particles. These contaminants can negatively affect bonding quality and long-term package reliability.
Plasma surface treatment effectively cleans and activates material surfaces, providing:
Improved surface cleanliness
Enhanced surface energy
Better micro bump bonding
Improved underfill adhesion
Increased package reliability
Typical applications include:
Wafer bonding
TSV processing
Micro bump packaging
Underfill preparation
CoWoS advanced packaging
PLAUX Plasma System provides professional plasma treatment solutions for semiconductor manufacturing and advanced packaging industries.
