The rapid growth of AI servers has significantly increased the demand for advanced semiconductor packaging technologies such as CoWoS, Chiplet, 2.5D packaging, and HBM integration.
During advanced packaging processes, contaminants, oxide layers, and microscopic particles may remain on wafer and substrate surfaces. These contaminants can negatively affect bonding quality, underfill adhesion, and long-term package reliability.
Plasma surface treatment effectively removes organic residues and activates material surfaces, resulting in:
Improved surface energy
Enhanced bonding strength
Better underfill adhesion
Reduced void formation
Improved package reliability
Typical applications include:
CoWoS Packaging
HBM Integration
Wafer-Level Packaging
Fan-Out Packaging
Chiplet Assembly
PLAUX Plasma System provides advanced plasma treatment solutions for semiconductor and AI packaging industries.
