Flexible Printed Circuits (FPCs) are widely used in smartphones, wearable devices, automotive electronics, and consumer electronics.
However, contaminants such as organic residues, release agents, and dust particles can remain on the surface during manufacturing processes.
These contaminants may cause:
* Poor adhesion
* Delamination
* Bonding failure
* Reduced product reliability
Benefits of Plasma Cleaning
* Removes organic contaminants
* Increases surface energy
* Improves wettability
* Enhances bonding strength
* Improves production yield
Typical Applications
* Stiffener bonding
* EMI shielding film lamination
* Adhesive dispensing
* SMT assembly
* Protective film lamination
Plasma cleaning has become an essential surface treatment process in modern FPC manufacturing.
PLAUX Plasma System provides professional plasma treatment solutions for the electronics industry.
