Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the substrate. It has the characteristics of high wiring density, light weight, thin thickness, and good bendability.

Flexible printed circuit board is a printed circuit made of flexible insulating substrate, which has many advantages that hard printed circuit boards do not have:

(1) It can be freely bent, wound, and folded, arranged according to spatial layout requirements, and can move and expand freely in three-dimensional space, thus achieving the integration of component assembly and wire connection;

(2) The use of FPC can greatly reduce the volume and weight of electronic products, meeting the needs of electronic product development towards high density, miniaturization, and high reliability. Therefore, FPC is used in aerospace, military, mobile communications, laptops, computer peripherals PDA、 Digital cameras and other fields or products have been widely used;

(3) FPC also has good heat dissipation and solderability, as well as advantages such as easy installation and low overall cost. The soft hard combination design also partially compensates for the slight deficiency of flexible substrates in component load-bearing capacity.

PCB（Printed Circuit Board）， It is an important electronic component, a support for electronic components, and a carrier for the electrical interconnection of electronic components. Due to its use of electronic printing technology, it is called a "printed" circuit board.

IC packaging carrier board is a key specialized basic material used for packaging integrated circuit card modules, with the main function of protecting chips and providing interfaces between chips and external circuits. Its shape is strip-shaped, usually golden yellow, and can be divided into 6PIN, 8PIN, dual interface, and non-contact packaging frames according to its purpose. The material is divided into two categories: metal based and epoxy based, which are respectively used for non-contact and contact card module packaging. All products are manufactured strictly in accordance with ISO and IEC standards, and the surface pattern supports customization.