Wafer Level Packaging

Description of wafer level packaging Equipment Name: Plasma Processing Equipment Equipment Model: PR160L Machine weight: about 500KG Rated power: 4KW wafer level packaging power supply: AC-380V/three-phase five-wire The overall specifications: 1450mm (W) × 1200mm (D) × 1720mm (H) Vacuum chamber...

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Description of wafer level packaging

Equipment Name: Plasma Processing Equipment

Equipment Model: PR160L

Machine weight: about 500KG

Rated power: 4KW

wafer level packaging power supply: AC-380V/three-phase five-wire

The overall specifications: 1450mm (W) × 1200mm (D) × 1720mm (H)

Vacuum chamber specifications: 600mm (W) × 600mm (D) × 600mm (H) imported aluminum

Electrode plate specifications: 570mm (W) × 490mm (D), 10 layers, plate spacing: 60mm, can be designed, can be reserved bracket

Bracket mode: custom aluminum bracket structure

Capacity: According to product specifications

Processing time: different process, different processing time

Plasma generator power: RF 13.56 MHz, adjustable from 0-1000W

Vacuum Pump System: Mechanical Vacuum Pump

Vacuum Measurement System: Pirani Resistance Gauge

Working vacuum: 20-80Pa

Vacuum pump limit pressure: 5.0×10-1Pa

Vacuum time: ≤120S

Breaking vacuum time: 30S

Gas supply method: solenoid valve type

Flowmeter adjustment range: 0-500Sccm (ml/min)

Input air pressure monitoring system: 2 air pressure decompression tables, 2 gas mass flow meters

Operation method: manually take and place the workpiece, start automatic control with a key

Using of wafer level packaging:

different combinations for different process manufacturing, can be used for devices, metal-based workpieces, ceramics, glass and other workpiece surface cleaning, modification and so on.


Company of wafer level packaging

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Package of wafer level packaging

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