Wafer Cleaning Machine

Wafer Cleaning Machine

Description of wafer cleaning machine Equipment Name: Cartridge Plasma Processing Equipment Equipment Model:VPC-500T Machine weight: about 350KG Rated power: 4KW wafer cleaning machine power supply: AC-380V/three-phase five-wire Specifications: 950mm(W)×1030mm(D)×1720mm(H) Vacuum chamber...

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Description of wafer cleaning machine

Equipment Name: Cartridge Plasma Processing Equipment

Equipment Model:VPC-500T

Machine weight: about 350KG

Rated power: 4KW

wafer cleaning machine power supply:AC-380V/three-phase five-wire

Specifications: 950mm(W)×1030mm(D)×1720mm(H)

Vacuum chamber specification: 480mm(W)×450mm(D)×400mm(H) imported aluminum

Capacity: 2 single cartridges processed at a time

Processing time: different process, different processing time

Plasma generator power: RF 13.56MH z, 0-500W adjustable

Vacuum Pump System: Mechanical Vacuum Pump

Vacuum Measurement System: Pirani Resistance Gauge

Working vacuum degree: 5-60Pa

Vacuum pump limit pressure: 4.0×10-1Pa

Vacuum time: ≤100S

Breaking vacuum time: 20-60S

Gas supply method: solenoid valve type

Flowmeter adjustment range: 0-300Sccm (ml/min)

Gas flow range: 0-50 Sccm (ml/min)

Input pressure monitoring system: accurate mass flow meter

Operation method: manually take and place the workpiece, start automatic control with a key

Using of wafer cleaning machine:

Different combinations are used for different process manufacturing. They are used exclusively in Diebond pre-cleaning, Molding pre-cleaning, Wafer surface cleaning and other processes in the semiconductor field.


Company of wafer cleaning machine:

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Package of wafer cleaning machine:

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