Plasma Cleaning for Wire Bonding

Plasma Cleaning for Wire Bonding

Description of plasma cleaning for wire bonding Machine name: cartridge type plasma processing equipment Machine Model: VPC-500F The whole specification: 920mm(W)×1030mm(D)×1720mm(H) Cavity specification of plasma cleaning for wire bonding: 435mm(W)×425mm(D)×540mm(H) Plasma Generator: 13.56MHz...

Send Inquiry Chat Now

Description of plasma cleaning for wire bonding

Machine name: cartridge type plasma processing equipment

Machine Model: VPC-500F

The whole specification: 920mm(W)×1030mm(D)×1720mm(H)

Cavity specification of plasma cleaning for wire bonding: 435mm(W)×425mm(D)×540mm(H)

Plasma Generator: 13.56MHz 0-500 Adjustable

Vacuum Pump System 1: Vacuum Pump Unit Pumped to 15Pa <100S in no-load condition

Automatic Control System: Human Machine Interface + PLC

Gas Metering and Control System: 2-way Vacuum Solenoid + MFC

Vacuum Measurement System: Pirani Resistance Gauge

Design advantages of plasma cleaning for wire bonding:

1, high productivity & high quality design

2. Roller carrier platform

3, special gas circuit design, good uniformity

4, manual / automatic operation mode, PLC control

5, special cavity structure, electrode and insulation design

The main advantages of plasma cleaning for wire bonding:

Increase the surface bonding strength of the patch process

§Improve the bonding force of the pressure welding process

§Reduce the delamination of the laminating process

Improve reliability and yield

§Good value for money

§ Operational stability, easy operation and maintenance

§ Low maintenance and operating costs

§ Fast response and good service

Application area of plasma cleaning for wire bonding:

1. Integrated circuit (IC) package or light emitting diode (LED) package, substrate cleaning before wire bonding, sealing, and ball mounting

2. Plastic Ball Grid Array (PBGA), Thin Ball Grid Array Package (TFBGA/Film-BGA), Low Profile Ball Grid Array (LFBGA), Thermal Gain Array Ball Grid Array (EBGA/VBGA), Pin Grid Array (Pin BGA) )

3, tape carrier package (TCP), printed circuit board (PCB), chip carrier board (COB)

4, copper lead frame (Cu L / F), silver-plated lead frame (Ag-Plating L / F), iron lead frame (Fe L / F)

5, flip chip (Flip-Chip), wafer level package (WLCSP) process cleaning


Company of plasma cleaning for wire bonding:

17.jpg


Package of plasma cleaning for wire bonding:

18.jpg

Hot Tags: plasma cleaning for wire bonding, China, manufacturers, factory, customized, made in China
Related Products

Copyright © Kunshan Plaux Electronics Technology Co.,Ltd All Rights Reserved.