Plasma for Semiconductor Packaging

  • Plasma Cleaning for Wire Bonding

    Description of plasma cleaning for wire bonding Machine name: cartridge type plasma processing equipment Machine Model: VPC-500F The whole specification: 920mm(W)×1030mm(D)×1720mm(H) Cavity specification of plasma cleaning for wire bonding: 435mm(W)×425mm(D)×540mm(H) Plasma...
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  • Wafer Level Packaging

    Description of wafer level packaging Equipment Name: Plasma Processing Equipment Equipment Model: PR160L Machine weight: about 500KG Rated power: 4KW wafer level packaging power supply: AC-380V/three-phase five-wire The overall specifications: 1450mm (W) × 1200mm (D) × 1720mm...
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  • Wafer Cleaning Machine

    Description of wafer cleaning machine Equipment Name: Cartridge Plasma Processing Equipment Equipment Model:VPC-500T Machine weight: about 350KG Rated power: 4KW wafer cleaning machine power supply: AC-380V/three-phase five-wire Specifications: 950mm(W)×1030mm(D)×1720mm(H)...
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  • Low Temperature Plasma Ashing

    Description of low temperature plasma ashing Equipment Name: Plasma Processing Equipment Equipment Model: PR160L Machine weight: about 500KG Rated power: 5KW low temperature plasma ashing power supply: AC-380V/three-phase five-wire The overall specifications: 1560mm (W) ×...
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We're known as one of the most professional plasma for semiconductor packaging manufacturers in China for our quality products and customized service. Please rest assured to buy quality plasma for semiconductor packaging made in China from our factory.

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