Plasma Treatment for PCB

Description of Plasma treatment for PCB Equipment Name: Roll-to-roll plasma processing equipment Plasma treatment for PCB Model: RTR100L-W500 Machine weight: about 2500KG Equipment specifications: 6900mm (W) × 1650mm (D) × 1150mm (H) cavity 3-stage Processing width: <520mm Plasma Generator:...

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Description of Plasma treatment for PCB

Equipment Name: Roll-to-roll plasma processing equipment

Plasma treatment for PCB Model: RTR100L-W500

Machine weight: about 2500KG

Equipment specifications: 6900mm (W) × 1650mm (D) × 1150mm (H) cavity 3-stage

Processing width: <520mm

Plasma Generator: 40KHz, 20KW

Air control system: gas flow controller 0-2000ml/min

Gas types and number of extensions: Standard 4-way process gas + 1 way compressed air

Electric control system: human-machine interface touch screen

Vacuum Measurement: 0-10Torr Thin Film Silicon Capacitance Corrosion Vacuum Gauge

Vacuum generation system: dry pump unit (screw pump + Roots pump) 120m3/h+1800 m3/h

Ultimate vacuum: ≤50mTorr

Frozen water flow: 5 SLM

Dry Air/N2 flow: 17 SLM

Temperature Control System: Process Temperature Control 30-150°C Constant Controllable

Ice water machine: AC380V, 3PH, 50/60Hz, 3KW

Ice water path: cooling for power supply, electrodes, vacuum pumping

Etching rate: ≥0.5μm/Min

Etching uniformity: ≥ 90%

Gas channel: 5 channel 5 gas

Tension Control: Using Digital Tension

Process gas requirements: 14MPa decompression to 0.3MPa, o2=9.99%; Ar=99.99%; N2=99.99%; CF4=99.999%

Process Gas Pressure Requirements: 0.2MPa≤Air Source≤1MPa

High pressure gas source pressure requirements: 0.3-0.8MPa

High-pressure air source purity requirements: Oil-free dry air Air

Working environment temperature requirement: ≤30°C

Plasma treatment for PCB advantages:

Vacuum chamber automatic switch, one-button start and stop, simple and convenient operation

Vacuum tension control system placed inside, stable materials increase and decrease, making the process more stable

High-performance plasma generator to excite more stable plasma

Horizontal electrode structure design, more suitable for flexible materials

The use of water-cooled electrodes in the pass, truly control the process temperature, balanced uniformity

Unique curling design to solve the problems of roll material wearing and traction material is more convenient

Precise speed control, precise control of speed, and constant speed and constant speed

Main functions: surface activation, surface roughening, surface modification, surface etching, surface grafting and other technical applications

Main processing objects: coilable coils, non-metallic metals, high surface treatment requirements

Processing method: horizontal volume continuous processing


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