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2-3 Flip Chip packaging
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Flip Chip packaging

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Flip Chip packaging:With the advent of flip-chip packaging technology, plasma cleaning has become a necessary condition for increasing its output. Plasma treatment of the chip and package carrier not only results in an ultra-cleaned solder surface, but also greatly enhances the activity of the solder surface, which can effectively prevent the occurrence of voids and reduce voids, and improve the edge height and containment of the filler. The mechanical strength of the package is improved, and the internal shear stress between the interfaces is reduced due to the thermal expansion coefficient of the different materials, and the product reliability and lifespan are improved.

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