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2-2 Wire Bonding
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Wire Bonding

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Wire Bonding:The quality of wire bonding has a decisive influence on the reliability of the microelectronic device, and the bonding area must be free of contaminants and have good bonding characteristics. The presence of contaminants, such as oxides, organic contaminants, etc., can severely impair the pull value of the wire bond. Plasma cleaning can effectively remove the surface contaminants in the bonding zone and increase its roughness, which can significantly increase the bonding pull force of the leads and greatly improve the reliability of the packaged device. 

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