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1-4 Ceramic Package
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ADDRESS: 3# Plant, No. 3232, BeiMen Road, High-tech Development Zone, Kunshan

FAX: +86-512-57711103

TEL: +86-512-57711102

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In the ceramic package, a metal paste printed circuit board is generally used as a bonding area and a lid sealing area. Plasma cleaning prior to electroplating of Ni and Au on the surface of these materials can remove organic contamination and significantly improve plating quality.


Product Size:37 mm×29mmBefore plasma:101.49°After plasma:21.5°

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